DocumentCode :
1401013
Title :
Modeling hot-carrier effects in polysilicon emitter bipolar transistors
Author :
Burnett, J.D. ; Hu Chenming
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA
Volume :
35
Issue :
12
fYear :
1988
fDate :
12/1/1988 12:00:00 AM
Firstpage :
2238
Lastpage :
2244
Abstract :
In self-aligned polysilicon emitter transistors a large electric field existing at the periphery of the emitter-base junction under reverse bias can create hot-carrier-induced degradation. The degradation of polysilicon emitter transistor gain under DC stress conditions can be modelled by ΔIBIR m+ntn where n≈0.5 and m ≈0.5. The more complex relationships of Δβ(I C, IR, t) and β(I C, IR, t) result naturally from the simple ΔIB model. Using these relationships the device lifetime can be extrapolated over a wide range of reverse stress currents for a given technology
Keywords :
bipolar transistors; elemental semiconductors; hot carriers; semiconductor device models; silicon; DC stress conditions; device lifetime estimation; emitter-base junction; hot-carrier effects; hot-carrier-induced degradation; modelling; poly-Si emitter bipolar transistors; polycrystalline Si; reverse bias; reverse stress currents; Artificial intelligence; Bipolar transistors; Degradation; Etching; Hot carrier effects; Hot carriers; Implants; Performance evaluation; Predictive models; Stress;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.8798
Filename :
8798
Link To Document :
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