Title :
CMOS RF Power Amplifier Variability and Reliability Resilient Biasing Design and Analysis
Author :
Liu, Yidong ; Yuan, Jiann-shiun
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Univ. of Central Florida, Orlando, FL, USA
Abstract :
This paper presents a novel biasing design that makes the complementary metal-oxide-semiconductor radio frequency power amplifier (PA) resilient to process variability and device reliability. The biasing scheme provides resilience through the threshold voltage adjustment, and at the mean time, it does not degrade the PA performance. Analytical equations are derived for studying the resilient biasing on PA process sensitivity. A class-AB PA with a resilient design is compared with a PA without such a design using a Predictive Technology Model 65-nm technology. The Advanced Design System simulation results show that the resilient biasing design helps improve the robustness of the PA in P1dB, Psat, and power-added efficiency. Except for postfabrication calibration capability, the adaptive body biasing design reduces the impact of variability and reliability on PA significantly when subjected to threshold voltage shift and electron mobility degradation.
Keywords :
CMOS analogue integrated circuits; MOSFET; Monte Carlo methods; electron mobility; power amplifiers; radiofrequency amplifiers; semiconductor device reliability; semiconductor doping; CMOS RF power amplifier variability; adaptive body biasing design; advanced design system; class-AB PA; electron mobility degradation; metal-oxide-semiconductor radio frequency power amplifier; postfabrication calibration capability; predictive technology model; reliability resilient biasing design; size 65 nm; threshold voltage shift; Degradation; Integrated circuit reliability; MOSFET circuits; Reliability engineering; Sensitivity; Threshold voltage; Hot electron; Monte Carlo simulation; positive bias temperature instability (PBTI); power amplifier (PA); random doping fluctuation; reliability; variability;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2010.2093141