Title :
Copper vapor effect on RF inductively coupled SF6 plasmas
Author :
Paul, Khokan Chandra ; Takashima, Takeshi ; Sakuta, Tadahiro
Author_Institution :
Dept. of Electr. & Comput. Eng., Kanazawa Univ., Japan
fDate :
6/1/1998 12:00:00 AM
Abstract :
Considering inductively coupled plasma (ICP) as an alternative way to study the copper (Cu) vapor effect in SF6 circuit breaker arcs, a two-dimensional, axisymmetric model was solved, for a torch of 82-mm inner diameter, to predict the change of plasma properties: temperature, velocity, electric and magnetic fields, joule heating, and Lorentz force. For the four considered sets of thermophysical properties with 0%, 0.1%, 1%, and 10% Cu concentration (molar) ratio in SF6 , plasma properties were calculated for 130-slpm gas flow: 80-slpm SF6 in the sheath channel and 50-slpm argon in the intermediate channel at pressure 100 and 200 torr. The radial temperature distribution as well as the Lorentz force and the joule heating broadened along the torch diameter by Cu vapor admixture. This predicted elongation of plasma for Cu vapor inclusion was confirmed experimentally determining the radial temperature distribution
Keywords :
circuit-breaking arcs; copper; electric fields; magnetic fields; plasma ohmic heating; plasma sheaths; plasma temperature; sulphur compounds; temperature distribution; velocity; 100 to 200 torr; Ar; Cu; Cu vapor admixture; Cu vapor effect; Cu vapor inclusion; Lorentz force; RF inductively coupled SF6 plasmas; SF6; SF6 circuit breaker arcs; electric fields; gas flow; joule heating; magnetic fields; plasma properties; radial temperature distribution; sheath channel; temperature; thermophysical properties; torch; two-dimensional axisymmetric model; velocity; Circuit breakers; Copper; Coupling circuits; Lorentz covariance; Plasma properties; Plasma temperature; Predictive models; Radio frequency; Resistance heating; Temperature distribution;
Journal_Title :
Plasma Science, IEEE Transactions on
