• DocumentCode
    1402237
  • Title

    Copper vapor effect on RF inductively coupled SF6 plasmas

  • Author

    Paul, Khokan Chandra ; Takashima, Takeshi ; Sakuta, Tadahiro

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Kanazawa Univ., Japan
  • Volume
    26
  • Issue
    3
  • fYear
    1998
  • fDate
    6/1/1998 12:00:00 AM
  • Firstpage
    1000
  • Lastpage
    1009
  • Abstract
    Considering inductively coupled plasma (ICP) as an alternative way to study the copper (Cu) vapor effect in SF6 circuit breaker arcs, a two-dimensional, axisymmetric model was solved, for a torch of 82-mm inner diameter, to predict the change of plasma properties: temperature, velocity, electric and magnetic fields, joule heating, and Lorentz force. For the four considered sets of thermophysical properties with 0%, 0.1%, 1%, and 10% Cu concentration (molar) ratio in SF6 , plasma properties were calculated for 130-slpm gas flow: 80-slpm SF6 in the sheath channel and 50-slpm argon in the intermediate channel at pressure 100 and 200 torr. The radial temperature distribution as well as the Lorentz force and the joule heating broadened along the torch diameter by Cu vapor admixture. This predicted elongation of plasma for Cu vapor inclusion was confirmed experimentally determining the radial temperature distribution
  • Keywords
    circuit-breaking arcs; copper; electric fields; magnetic fields; plasma ohmic heating; plasma sheaths; plasma temperature; sulphur compounds; temperature distribution; velocity; 100 to 200 torr; Ar; Cu; Cu vapor admixture; Cu vapor effect; Cu vapor inclusion; Lorentz force; RF inductively coupled SF6 plasmas; SF6; SF6 circuit breaker arcs; electric fields; gas flow; joule heating; magnetic fields; plasma properties; radial temperature distribution; sheath channel; temperature; thermophysical properties; torch; two-dimensional axisymmetric model; velocity; Circuit breakers; Copper; Coupling circuits; Lorentz covariance; Plasma properties; Plasma temperature; Predictive models; Radio frequency; Resistance heating; Temperature distribution;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/27.700881
  • Filename
    700881