Efficient hybrid TLM/mode-matching analysis of packaged components

Author

Righi, Mario ; Herring, Jonathan L. ; Hoefer, Wolfgang J R

Author_Institution

Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada

Volume

45

Issue

10

fYear

1997

fDate

10/1/1997 12:00:00 AM

Firstpage

1715

Lastpage

1724

Abstract

A combination of the transmission-line matrix (TLM) method and time-domain mode-matching method is proposed. The resulting hybrid algorithm takes full advantage of time-domain methods for regions with highly complex geometries while exploiting the efficiency of analytical formulations for the more regular regions. The computational aspects and the errors involved in the procedure are investigated. The approach is demonstrated with the analysis of a packaged microstrip line containing a via-hole, and results are compared with independent measurements. While the planar circuit is discretized by a TLM mesh, the field in the package is decomposed into modal fields. The two sub-domains are joined by modal diakoptics. Thus, we obtain not only a significant reduction in computer time and memory, but also gain new physical insight into the physics of package resonance

Keywords

microstrip lines; mode matching; packaging; transmission line matrix methods; discretization; hybrid algorithm; microstrip line; microwave component; modal diakoptics; package resonance; planar circuit; time-domain mode-matching; transmission line matrix; via hole; Algorithm design and analysis; Circuits; Geometry; Independent component analysis; Microstrip; Mode matching methods; Packaging; Time domain analysis; Transmission line matrix methods; Transmission lines;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.641717

Filename

641717