• DocumentCode
    140242
  • Title

    Classification of finger extension and flexion of EMG and Cyberglove data with modified ICA weight matrix

  • Author

    Naik, G. Rajender ; Acharyya, Amit ; Nguyen, Hung T.

  • Author_Institution
    Centre for Health Technol. (CHT), Univ. of Technol. Sydney (UTS), Broadway, NSW, Australia
  • fYear
    2014
  • fDate
    26-30 Aug. 2014
  • Firstpage
    3829
  • Lastpage
    3832
  • Abstract
    This paper reports the classification of finger flexion and extension of surface Electromyography (EMG) and Cyberglove data using the modified Independent Component Analysis (ICA) weight matrix. The finger flexion and extension data are processed through Principal Component Analysis (PCA), and next separated using modified ICA for each individual with customized weight matrix. The extension and flexion features of sEMG and Cyberglove (extracted from modified ICA) were classified using Linear Discriminant Analysis (LDA) with near 90% classification accuracy. The applications of this study include Human Computer Interface (HCI), virtual reality and neural prosthetics.
  • Keywords
    biomechanics; data gloves; electromyography; independent component analysis; medical signal processing; neurophysiology; principal component analysis; prosthetics; signal classification; virtual reality; Cyberglove data; HCI; Human Computer Interface; LDA; Linear Discriminant Analysis; PCA; Principal Component Analysis; classification accuracy; customized weight matrix; finger extension classification; finger extension data; finger flexion classification; finger flexion data; modified ICA weight matrix; modified Independent Component Analysis weight matrix; neural prosthetics; sEMG; surface electromyography; virtual reality; Electromyography; Feature extraction; Principal component analysis; Sensors; Surface treatment; Thumb;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2014.6944458
  • Filename
    6944458