MCM packaging for present- and next-generation high clock-rate digital- and mixed-signal electronic systems: areas for development

Author

Gilbert, Barry K. ; Pan, Guang-Wen

Author_Institution

Special Purpose Processor Dev. Group, Mayo Found., Rochester, MN, USA

Volume

45

Issue

10

fYear

1997

fDate

10/1/1997 12:00:00 AM

Firstpage

1819

Lastpage

1835

Abstract

This paper will review the manner in which electronic packaging will be driven by the high-level performance requirements of next-generation mixed-signal systems, and by the evolving characteristics of next-generation integrated circuits. Present performance and fabrication limitations of the multichip module (MCM) technology will be discussed, as well as possible approaches to remove or minimize these constraints. Areas fruitful for research by the simulation community will be noted. This review is intended to provide a broad applications-oriented framework for the theoretical and simulation-directed papers in this special issue on interconnect and packaging

Keywords

digital integrated circuits; integrated circuit packaging; mixed analogue-digital integrated circuits; multichip modules; MCM; clock rate; digital-signal system; electronic packaging; integrated circuit; mixed-signal system; multichip module; simulation; Circuit simulation; Clocks; Dielectrics; Electronics packaging; Fabrication; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Multichip modules; Printed circuits;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.641780

Filename

641780