Title :
When are transmission-line effects important for on-chip interconnections?
Author :
Deutsch, Alina ; Kopcsay, Gerard V. ; Restle, Phillip J. ; Smith, Howard H. ; Katopis, G. ; Becker, Wiren D. ; Coteus, Paul W. ; Surovic, Christopher W. ; Rubin, Barry J. ; Dunne, Richard P., Jr. ; Gallo, T. ; Jenkins, Keith A. ; Terman, Lewis M. ; Dennar
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fDate :
10/1/1997 12:00:00 AM
Abstract :
Short, medium, and long on-chip interconnections having linewidths of 0.45-52 μm are analyzed in a five-metal-layer structure. We study capacitive coupling for short lines, inductive coupling for medium-length lines, inductance and resistance of the current return path in the power buses, and line resistive losses for the global wiring. Design guidelines and technology changes are proposed to achieve minimum delay and contain crosstalk for local and global wiring. Conditional expressions are given to determine when transmission-line effects are important for accurate delay and crosstalk prediction
Keywords :
crosstalk; delays; integrated circuit interconnections; transmission line theory; 0.45 to 0.52 micron; capacitive coupling; crosstalk; delay; design; global wiring; inductive coupling; local wiring; metal multilayer; on-chip interconnection; power bus; resistive loss; transmission line effect; Capacitance; Couplings; Crosstalk; Delay; Guidelines; Inductance; Integrated circuit interconnections; Space technology; Transmission lines; Wiring;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
