Application of system-level EM modeling to high-speed digital IC packages and PCBs

Author

Yook, Jong-Gwan ; Katehi, Linda P B ; Sakallah, Karem A. ; Martin, Ray S. ; Huang, Lilly ; Schreyer, Tim A.

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA

Volume

45

Issue

10

fYear

1997

fDate

10/1/1997 12:00:00 AM

Firstpage

1847

Lastpage

1856

Abstract

A system-level electromagnetic (EM) modeling tool combining a three-dimensional (3-D) full-wave finite-element EM-field analysis tool and a time-domain electric-circuit simulator is developed and applied to various geometries such as multilayer printed circuit boards (PCBs), signal lines embedded in a PCB or package, and split power-distribution network. Since the signal integrity is a primary concern of high-speed digital circuits, the noise distributions on various circuit planes are evaluated from the analysis. These noise distributions, often called voice maps, are utilized to identify the location of the major source of simultaneous switching noise (SSN). This information can eventually be adapted for optimum placement of decoupling capacitors to minimize the noise fluctuations on the various circuit planes on an entire PCB

Keywords

circuit analysis computing; digital integrated circuits; finite element analysis; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; printed circuits; decoupling capacitor; high-speed digital IC package; multilayer printed circuit board; noise distribution; signal line; simultaneous switching noise; split power-distribution network; system-level electromagnetic model; three-dimensional full-wave finite-element EM-field analysis; time-domain electric-circuit simulator; voice map; Application specific integrated circuits; Circuit noise; Digital integrated circuits; Electromagnetic modeling; Finite element methods; High speed integrated circuits; Integrated circuit modeling; Power system modeling; Signal analysis; Solid modeling;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.641782

Filename

641782