Title :
The finite-element method for modeling circuits and interconnects for electronic packaging
Author :
Polycarpou, Anastasis C. ; Tirkas, Panayiotis A. ; Balanis, Constantine A.
Author_Institution :
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
fDate :
10/1/1997 12:00:00 AM
Abstract :
A full-wave finite-element method (FEM) is formulated and applied in the analysis of practical electronic packaging circuits and interconnects. The method is used to calculate S-parameters of unshielded microwave components such as patch antennas, filters, spiral inductors, bridges, bond wires, and microstrip transitions through a via. Although only representative microwave passive circuits and interconnects are analyzed in this paper, the underlined formulation is applicable to structures of arbitrary geometrical complexities including microstrip and coplanar-waveguide transitions, multiple conducting vias and solder bumps, multiple striplines, and multilayer substrates. The accuracy of the finite-element formulation is extensively verified by calculating the respective S-parameters and comparing them with results obtained using the finite-difference time-domain (FDTD) method. Computational statistics for both methods are also discussed
Keywords :
S-parameters; finite element analysis; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; microwave integrated circuits; S-parameters; bond wire; bridge; coplanar-waveguide transition; electronic packaging; filter; full-wave finite-element model; interconnect; microstrip transition; microwave passive circuit; multilayer substrate; multiple conducting via; multiple stripline; patch antenna; solder bump; spiral inductor; Electronics packaging; Finite difference methods; Finite element methods; Integrated circuit interconnections; Microwave filters; Microwave theory and techniques; Patch antennas; Scattering parameters; Spirals; Time domain analysis;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
