DocumentCode :
1402664
Title :
Hybrid electromagnetic modeling of noise interactions in packaged electronics based on the partial-element equivalent-circuit formulation
Author :
Pinello, William ; Cangellaris, Andreas C. ; Ruehli, Albert
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Volume :
45
Issue :
10
fYear :
1997
fDate :
10/1/1997 12:00:00 AM
Firstpage :
1889
Lastpage :
1896
Abstract :
The partial-element equivalent-circuit (PEEC) method is used to develop a flexible, hierarchical electromagnetic modeling and simulation environment for the analysis of noise generation and signal degradation mechanisms in packaged electronic components and systems. The circuit-oriented approach used by the method for the development of the numerical approximation of the electric-field integral equation leads to SPICE-compatible, yet fully dynamic, discrete approximation of the electromagnetic problem. Contrary to other full-wave formulations, the proposed method has the important attribute of lending itself to a very systematic and physical model complexity reduction on the basis of the electrical size of the various portions of the system. Thus, a hybrid electromagnetic modeling and simulation environment is established for the analysis of complex structures which exhibit large variation in electrical size over their volume, using a combination of lumped-circuit elements, transmission lines, as well as three-dimensional (3-D) distributed electromagnetic models. These models may or may not account for retardation, depending on the electrical size of the part of the structure that is being modeled. These special attributes of the proposed electromagnetic-simulation environment are demonstrated through several examples from its application to the modeling of noise interactions in generic interconnect and package geometries
Keywords :
equivalent circuits; finite element analysis; integral equations; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; EM simulation; discrete numerical approximation; electric field integral equation; hybrid electromagnetic model; interconnect; lumped circuit elements; noise generation; packaged electronics; partial-element equivalent-circuit; signal degradation; three-dimensional distributed hierarchical model; transmission line; Analytical models; Circuit noise; Circuit simulation; Electromagnetic analysis; Electromagnetic interference; Electromagnetic modeling; Electronics packaging; Noise generators; Signal analysis; Working environment noise;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/22.641787
Filename :
641787
Link To Document :
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