High-frequency circuit modeling of large pin count packages

Author

Sercu, Stefaan ; Marten, L.

Author_Institution

Dept. of Inf. Technol., Ghent Univ., Belgium

Volume

45

Issue

10

fYear

1997

fDate

10/1/1997 12:00:00 AM

Firstpage

1897

Lastpage

1904

Abstract

In this paper, a technique is presented for the high-frequency circuit modeling of coupled conductor structures. The method is, in particular, very useful for the modeling of structures with a varying signal/ground configuration. Structures with a large number of conductors (N+1, N>100) are also easy to model, as the method reduces the modeling of the 2N-port to the modeling of two- and four-port structures. Two- and four-port structures are much easier to model since their equivalent circuit model has fewer parameter values. Examples of multiconductor structures are high-density connectors and large pin count electronic packages. The model accurately simulates the electrical properties, such as reflection and transmission of all conductors, and the backward and forward crosstalk to all other conductors

Keywords

electric connectors; equivalent circuits; multiport networks; packaging; coupled conductor; crosstalk; electrical properties; equivalent circuit; four-port structure; high-density connector; high-frequency circuit model; large pin count electronic package; multiconductor; reflection; signal/ground configuration; transmission; two-port structure; Circuit simulation; Clocks; Conductors; Connectors; Coupling circuits; Electronics packaging; Equivalent circuits; Frequency; Integrated circuit interconnections; Transmission line matrix methods;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.641788

Filename

641788