Title :
Microwave-circuit modeling of high lead-count plastic packages
Author :
Jackson, Robert W. ; Rakshit, Sambarta
Author_Institution :
Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
fDate :
10/1/1997 12:00:00 AM
Abstract :
A microwave-circuit model topology for elevated-paddle surface-mount packages is extended to packages with high-lead counts. Features such as irregular lead structures, long wirebonds, smaller pitches, and finite-lead thickness are all examined. The modeling technique is applied to a shrink small-outline package (SSOP-24) with the results compared to measurements of a 25 times size scale model. The circuit model is used to investigate the performance of a matched transition
Keywords :
MMIC; equivalent circuits; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; plastic packaging; surface mount technology; SMD; SMT; SSOP-24; elevated-paddle surface-mount packages; finite-lead thickness; high lead-count plastic packages; irregular lead structures; long wirebonds; matched transition; microwave-circuit model topology; modeling technique; pitch size; shrink small-outline package; Circuit simulation; Circuit topology; Grounding; Integrated circuit modeling; Integrated circuit packaging; Lead; MMICs; Microwave integrated circuits; Plastic packaging; Trademarks;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
