Title :
Automatic netlist extraction for measurement-based characterization of off-chip interconnect
Author :
Corey, Steven D. ; Yang, Andrew T.
Author_Institution :
Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
fDate :
10/1/1997 12:00:00 AM
Abstract :
An approach is presented for modeling board-level, package-level, and multichip module (MCM) substrate-level interconnect circuitry based on measured time-domain reflectometry (TDR) data. The time-domain scattering parameters of a multiport system are used to extract a SPICE netlist from standard elements to match the behavior of the device up to a user-specified cutoff frequency. Linear or nonlinear circuits may be connected to the model ports, and the entire circuit simulated in a standard circuit simulator. Two- and four-port microstrip-circuit examples are characterized, and the simulation results are compared with measured data. Delay, reflection, transmission, and crosstalk are accurately modeled in each case
Keywords :
S-parameters; SPICE; circuit analysis computing; crosstalk; delays; integrated circuit interconnections; integrated circuit packaging; microstrip circuits; multichip modules; printed circuits; state-space methods; time-domain reflectometry; MCM substrate-level interconnect circuitry; SPICE netlist; TDR data; automatic netlist extraction; board-level interconnect circuitry; circuit simulator; crosstalk modelling; delay modelling; linear circuits; measurement-based characterization; multichip module; multiport syste; nonlinear circuits; off-chip interconnect; package-level interconnect circuitry; reflection modelling; time-domain reflectometry data; time-domain scattering parameters; transmission modelling; Circuit simulation; Cutoff frequency; Data mining; Integrated circuit interconnections; Multichip modules; Packaging; Reflectometry; SPICE; Scattering parameters; Time domain analysis;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
