• DocumentCode
    1402730
  • Title

    Accurate frequency-domain modeling and efficient circuit simulation of high-speed packaging interconnects

  • Author

    Beyene, Wendemagagnehu T. ; Schutt-Ainé, José E.

  • Author_Institution
    Hewlett-Packard EEsof Div., Westlake Village, CA, USA
  • Volume
    45
  • Issue
    10
  • fYear
    1997
  • fDate
    10/1/1997 12:00:00 AM
  • Firstpage
    1941
  • Lastpage
    1947
  • Abstract
    The paper describes an efficient frequency-domain modeling and simulation method of a coupled interconnect system using scattering parameters. First, low-order rational approximations of the multiport scattering parameters are derived over a wide frequency range using a robust interpolation technique. The method applies frequency normalization, shift, and Householder QR orthogonalization to improve the stability and the accuracy when solving the resulting systems of equations. For interconnects characterized with frequency-dependent parasitic parameters, the order of the rational of approximation is reduced by using appropriate reference system. Then, the generated multiport pole-residue models are incorporated into a circuit simulator using recursive convolution. Thus, the method avoids explicit convolution, numerical transform, and artificial filtering of a large number of points that are often necessary in conventional approaches. Examples with experimental and simulated results are given to illustrate the method
  • Keywords
    S-parameters; circuit analysis computing; frequency-domain analysis; integrated circuit interconnections; integrated circuit packaging; multiport networks; Householder QR orthogonalization; circuit simulation; coupled interconnect; frequency normalization; frequency shift; frequency-domain model; high-speed packaging interconnect; interpolation; low-order rational approximation; multiport pole-residue model; parasitic parameters; recursive convolution; scattering parameters; Circuit simulation; Circuit stability; Convolution; Coupling circuits; Equations; Frequency; Integrated circuit interconnections; Interpolation; Robustness; Scattering parameters;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.641798
  • Filename
    641798