DocumentCode
1402770
Title
Coax via-A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling
Author
Pillai, Edward R.
Author_Institution
Div. of Microelectron., IBM Corp., Hopewell Junction, NY, USA
Volume
45
Issue
10
fYear
1997
fDate
10/1/1997 12:00:00 AM
Firstpage
1981
Lastpage
1985
Abstract
Large-scale crosstalk at vias and poor via electrical performance are major drawbacks in state-of-the-art high-frequency multilayer first- or second-level integrated-circuit/monolithic-microwave integrated-circuit (IC/MMIC) packages. The coax via design modeled in this paper breaks new ground in achieving more than 30-dB ultrawide-band crosstalk reduction and providing an enhanced impedance match
Keywords
MMIC; crosstalk; finite difference time-domain analysis; impedance matching; integrated circuit packaging; method of moments; FDTD model; IC; MMIC; MoM model; coax via; crosstalk; high-frequency multilayer package; impedance matching; Coaxial components; Crosstalk; Finite difference methods; Impedance; Integrated circuit modeling; Integrated circuit packaging; Microstrip; Nonhomogeneous media; Stripline; Time domain analysis;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/22.641808
Filename
641808
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