• DocumentCode
    1403426
  • Title

    Nickel–chromium alloy piezoresistive pressure sensor using eutectic bonding

  • Author

    Lidong Du ; Zhan Zhao ; Li Xiao ; Zhen Fang ; Qing Tian ; Xuejin Sun ; Xiaolei Wang

  • Author_Institution
    State Key Lab. of Transducer Technol., Inst. of Electron., Beijing, China
  • Volume
    7
  • Issue
    12
  • fYear
    2012
  • fDate
    12/1/2012 12:00:00 AM
  • Firstpage
    1184
  • Lastpage
    1188
  • Abstract
    A nickel-chromium (Ni-Cr) piezoresistive pressure sensor is presented, which has the advantages of low-cost and easy fabrication processes. In the designed sensor, Ni-Cr alloy (80:20-wt-), which can be fabricated using simple processes, is used as the strain-detecting material with a smaller but acceptable gauge factor. Eutectic-bonding technology, based on silver-tin (Ag-Sn) alloy, which contains 3.5-wt- Ag and has 20--m thickness, is used as an alternative and easy bonding choice to complete the vacuum package. Normally, Ag-Sn alloy is mostly obtained by the electrochemical deposition method. However, here the Ag-Sn solder film is directly used as a bonding material. It reduces the fabrication difficulty of eutectic bonding of the proposed pressure sensor. By studying the processes of annealing of Ni-Cr fabrication and eutectic bonding with Ag-Sn, the authors complete the alloy piezoresistive atmosphere pressure sensor. Bonding quality is evaluated by inspection through the deflection of a diaphragm of silicon with more than 95- of the area successfully bonded. The pressure-voltage characteristic test results suggest a precision within 0.3- in square fitting. The temperature coefficient offset is 620-ppm/(-C free space optic (FSO)).
  • Keywords
    annealing; bonding processes; chromium alloys; eutectic alloys; inspection; nickel alloys; piezoresistive devices; pressure sensors; silver alloys; solders; tin alloys; Ag-Sn; Ni-Cr; annealing processes; bonding material; electrochemical deposition method; eutectic bonding; fabrication processes; gauge factor; inspection; nickel-chromium alloy piezoresistive atmosphere pressure sensor; pressure-voltage characteristic test; silicon diaphragm; silver-tin alloy; solder film; square fitting; strain-detecting material; temperature coefficient offset;
  • fLanguage
    English
  • Journal_Title
    Micro & Nano Letters, IET
  • Publisher
    iet
  • ISSN
    1750-0443
  • Type

    jour

  • DOI
    10.1049/mnl.2012.0552
  • Filename
    6419589