Non-planar surface bonding with spray-coated SU-8 as adhesive layer

Author

Nannan Li ; Shuwei He ; Qiancheng Zhao ; Shibin Zhang ; Jing Chen

Author_Institution

Nat. Key Lab. on Micro/Nano Fabrication Technol., Inst. of Microelectron., Peking Univ., Beijing, China

Volume

7

Issue

12

fYear

2012

fDate

12/1/2012 12:00:00 AM

Firstpage

1220

Lastpage

1222

Abstract

In this study, substrates with a large topography were aligned and bonded, and a spray-coated SU-8 was employed as the adhesive layer between two complementary non-planar surfaces. Both wafer-level and chip-level bonding were carried out with an alignment tolerance of 5 m. The bonding pairs exhibited enhanced tensile strength and shearing strength compared to that of the planar surface bonding, which was influenced by the gap between the bonding surfaces. This technology meets the requirements of the wafer-level three-dimensional structure transfer and opens up possibilities for manufacturing more complicated microelectromechanical systems devices.

Keywords

adhesive bonding; organic compounds; photoresists; shear strength; spray coating techniques; surface topography; tensile strength; wafer bonding; adhesive layer; alignment tolerance; bonding pairs; chip-level bonding; complementary nonplanar surfaces; enhanced tensile strength; large topography; microelectromechanical system devices; nonplanar surface bonding; shearing strength; spray-coated SU-8; wafer-level bonding; wafer-level three-dimensional structure transfer;

fLanguage

English

Journal_Title

Micro & Nano Letters, IET

Publisher

iet

ISSN

1750-0443

Type

jour

DOI

10.1049/mnl.2012.0582

Filename

6419598