• DocumentCode
    1403601
  • Title

    An ultraminiature solid-state pressure sensor for a cardiovascular catheter

  • Author

    Chau, Hin-Leung ; Wise, Kenesall D.

  • Author_Institution
    Center for Integrated Sensors & Circuits, Michigan Univ., Ann Arbor, MI, USA
  • Volume
    35
  • Issue
    12
  • fYear
    1988
  • fDate
    12/1/1988 12:00:00 AM
  • Firstpage
    2355
  • Lastpage
    2362
  • Abstract
    An ultraminiature solid-state capacitive pressure sensor that can be mounted in a 0.5-mm OD catheter suitable for multipoint pressure measurements from within the coronary artery of the heart is described. The transducer consists of a silicon 290×550×1.5-μm3 microdiaphragm surrounded by a 12-μm-thick silicon supporting rim, both defined by the boron etch-stop technique. The transducer process features a batch wafer-to-glass electrostatic seal followed by the silicon etch, which eliminates handling of individual small diaphragm structures until die separation and final packaging. A hybrid interface circuit chip provides a high-level output signal and allows the sensor to be compatible with use on a multisite catheter having only two leads
  • Keywords
    biological techniques and instruments; electric sensing devices; field effect integrated circuits; pressure transducers; 0.5 mm; 1.5 to 550 micron; batch wafer-to-glass electrostatic seal; capacitive pressure sensor; cardiovascular catheter; high-level output signal; hybrid interface circuit chip; microdiaphragm; multipoint pressure measurements; multisite catheter; ultraminiature solid-state pressure sensor; Arteries; Capacitive sensors; Cardiology; Catheters; Etching; Pressure measurement; Sensor phenomena and characterization; Silicon; Solid state circuits; Transducers;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.8814
  • Filename
    8814