Title :
Reliability of 1300-nm spot-size converter integrated laser diodes for low-cost optical modules in access networks
Author :
Oohashi, Hiromi ; Fukuda, Mitsuo ; Kondo, Yasuhiro ; Wada, Masato ; Tohmori, Yuichi ; Sakai, Yoshihisa ; Toba, Hiromi ; Itaya, Yoshio
Author_Institution :
NTT Opto-Electron. Labs., Kanagawa, Japan
fDate :
7/1/1998 12:00:00 AM
Abstract :
This paper discusses the degradation behaviors and reliability of spot-size converter integrated laser diodes fabricated using the full wafer process with dry etching and metal organic vapor phase epitaxy (MOVPE). Failure criteria applicable to actual access networks were determined based on the degradation behavior exhibited in several aging tests, and device lifetimes were then estimated. The far-field patterns and wide-temperature operation required for low-cost system application scarcely changed during degradation, even after a 150% increase in threshold current. Within this degradation range, the device life for system application is estimated to be more than 105 h at 60°C and 10 mW
Keywords :
ageing; infrared sources; laser reliability; laser transitions; modules; optical fabrication; optical fibre subscriber loops; optical testing; optical transmitters; semiconductor device reliability; semiconductor device testing; semiconductor growth; vapour phase epitaxial growth; 10 mW; 1300 nm; 1300-nm spot-size converter integrated laser diode reliability; 1E5 h; 60 C; MOVPE; access networks; degradation behavior; degradation behaviors; device life; device lifetimes; dry etching; failure criteria; far-field patterns; full wafer process; low-cost optical modules; low-cost system application; metal organic vapor phase epitaxy; several aging tests; spot-size converter integrated laser diode fabrication; system application; threshold current; wide-temperature operation; Aging; Diode lasers; Dry etching; Epitaxial growth; Epitaxial layers; Life estimation; Life testing; Lifetime estimation; Thermal degradation; Threshold current;
Journal_Title :
Lightwave Technology, Journal of