High Q microwave inductors on silicon by surface tension self-assembly

A new technique is presented for the fabrication of three-dimensional metal structures by surface tension-induced folding of flat structures. This fully parallel, low temperature method is suitable for post-processing on integrated circuits, and in a first application is used to decouple inductors for radio and microwave-frequency integrated circuits from their substrates, to reduce losses and parasitic capacitance. Meandered microwave inductors have been fabricated on a low resistivity silicon substrate. A peak Q of 10 was measured at 1 GHz, for a 2 nH inductor standing vertically, compared to a peak Q of 4 for the same structure before self assembly