Title :
Analysis of delay time instability according to the operating frequency in field shield isolated SOI circuits
Author :
Maeda, Shigenobu ; Yamaguchi, Yasuo ; Kim, Il-Jung ; Iwamatsu, Toshiaki ; Ipposhi, Takashi ; Miyamoto, Shoichi ; Maegawa, Shigeto ; Ueda, Kimio ; Nii, Koji ; Mashiko, Koichiro ; Inoue, Yasuo ; Nishimura, Tadashi ; Miyoshi, Hirokazu
Author_Institution :
LSI Res. & Dev. Lab., Mitsubishi Electr. Corp., Hyogo, Japan
fDate :
7/1/1998 12:00:00 AM
Abstract :
It has been demonstrated that field shield (FS) isolation technology can suppress the delay time instability according to the operating frequency. The FS isolation technology has been proposed to fix the body potential without any area penalty in a gate array. In this technology, an FS plate, which is an additional polysilicon gate, is introduced to electrically isolate active regions. The body potential of the SOI MOSFET can be fixed through the SOI layer under the FS plate. The effect of body resistance on the delay time instability was also investigated using device simulation. The simulation showed that although the body potential momentarily falls to a nonsteady level due to capacitive coupling during switching operation, the body potential recovers to a steady level, following the RC law. From the simulation result, a helpful design guideline concerning the body resistance was deduced. This guideline showed that the FS isolation has a superior capability to suppress the frequency-dependent instability for practical deep submicron SOI circuits
Keywords :
MOSFET; circuit stability; isolation technology; silicon-on-insulator; FS plate; RC law; SOI MOSFET; body potential; body resistance; capacitive coupling; deep submicron SOI circuit; delay time instability; device simulation; field shield isolation; operating frequency; polysilicon gate; switching operation; Circuit simulation; Delay effects; Frequency; Guidelines; Immune system; Isolation technology; Laboratories; MOSFET circuits; Silicon on insulator technology; Ultra large scale integration;
Journal_Title :
Electron Devices, IEEE Transactions on