DocumentCode :
1405420
Title :
The current density distribution of the GaAs power MESFET: a theory for device burnout
Author :
Chang, Chan-sern ; Day, Ding-yuan S.
Author_Institution :
Avantek Inc., Santa Clara, CA, USA
Volume :
37
Issue :
4
fYear :
1990
fDate :
4/1/1990 12:00:00 AM
Firstpage :
1162
Lastpage :
1163
Abstract :
The burnout of a GaAs power MESFET is initiated at the edge of the drain ohmic contact due to the high local current density. A two-dimensional Poisson equation is solved to obtain the current density distribution under the drain. The maximum current density is found to be proportional to the drain current and inversely proportional to the thickness of the active layer under the drain. The burnout voltage can therefore be improved by adding a gate recess to allow a thicker active layer under the drain
Keywords :
III-V semiconductors; Schottky gate field effect transistors; current density; current distribution; gallium arsenide; power transistors; reliability; semiconductor device models; GaAs; active layer thickness; burnout voltage improvement; current density distribution; device burnout; drain current; drain ohmic contact; gate recess; power MESFET; two-dimensional Poisson equation; Boundary conditions; Buffer layers; Current density; Electrons; Gallium arsenide; Laplace equations; MESFETs; Ohmic contacts; Poisson equations; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.52455
Filename :
52455
Link To Document :
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