• DocumentCode
    1406470
  • Title

    A novel bidirectional optical coupling module for subscribers

  • Author

    Joo, Gwan-Chong ; Lee, Sang-Hwan ; Park, Ki-Sung ; Choi, Jae-Shik ; Hwang, Nam ; Song, Min-Kyu

  • Author_Institution
    Microelectron. Technol. Lab., Electron. & Telecommun. Res. Inst., Taejon, South Korea
  • Volume
    23
  • Issue
    4
  • fYear
    2000
  • fDate
    11/1/2000 12:00:00 AM
  • Firstpage
    681
  • Lastpage
    685
  • Abstract
    To overcome drawbacks and limitations of planar lightwave circuit based modules for bidirectional communications, such as the demand for several chips and in consequence more packaging efforts, we have recently developed a novel optical coupling technique using our unique 155 Mbps bidirectional laser chip. Since the chip is structured with a pin-photodiode monolithically integrated on a laser diode´s waveguide, the optical coupling requires only the alignment of the chip with a fiber. To optically couple the laser diode and photodiode simultaneously with a single fiber, we have designed an unusual coupling structure using a fiber having a cleaved surface whose normal is 35° angled to the fiber core axis, and using an index-controlling medium with a refractive index of ∼1.3. The bidirectional chip is flip-chip bonded and the fiber is passively aligned using a V-groove on the same substrate of 2.5×1.3 mm2 in size. Even with this extremely small and simple scheme for bidirectional optical coupling, we could obtain an optical output power of -7∼-10 dBm and a responsivity of <-30 dBm, which are satisfactory to the STM-1 level telecommunications specifications.
  • Keywords
    elemental semiconductors; flip-chip devices; optical communication equipment; optical fibre couplers; optical fibre subscriber loops; optical planar waveguides; p-i-n photodiodes; refractive index; semiconductor device packaging; silicon; transceivers; 155 Mbit/s; STM-1 level telecommunications specifications; Si; V-groove; bidirectional optical coupling module; cleaved surface; coupling structure; flip-chip bonding; index-controlling medium; optical output power; packaging efforts; pin-photodiode; planar lightwave circuit based modules; refractive index; responsivity; Bidirectional control; Circuits; Diodes; Fiber lasers; Optical coupling; Optical refraction; Optical variables control; Optical waveguides; Packaging; Waveguide lasers;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/6040.883758
  • Filename
    883758