Title :
A novel bidirectional optical coupling module for subscribers
Author :
Joo, Gwan-Chong ; Lee, Sang-Hwan ; Park, Ki-Sung ; Choi, Jae-Shik ; Hwang, Nam ; Song, Min-Kyu
Author_Institution :
Microelectron. Technol. Lab., Electron. & Telecommun. Res. Inst., Taejon, South Korea
fDate :
11/1/2000 12:00:00 AM
Abstract :
To overcome drawbacks and limitations of planar lightwave circuit based modules for bidirectional communications, such as the demand for several chips and in consequence more packaging efforts, we have recently developed a novel optical coupling technique using our unique 155 Mbps bidirectional laser chip. Since the chip is structured with a pin-photodiode monolithically integrated on a laser diode´s waveguide, the optical coupling requires only the alignment of the chip with a fiber. To optically couple the laser diode and photodiode simultaneously with a single fiber, we have designed an unusual coupling structure using a fiber having a cleaved surface whose normal is 35° angled to the fiber core axis, and using an index-controlling medium with a refractive index of ∼1.3. The bidirectional chip is flip-chip bonded and the fiber is passively aligned using a V-groove on the same substrate of 2.5×1.3 mm2 in size. Even with this extremely small and simple scheme for bidirectional optical coupling, we could obtain an optical output power of -7∼-10 dBm and a responsivity of <-30 dBm, which are satisfactory to the STM-1 level telecommunications specifications.
Keywords :
elemental semiconductors; flip-chip devices; optical communication equipment; optical fibre couplers; optical fibre subscriber loops; optical planar waveguides; p-i-n photodiodes; refractive index; semiconductor device packaging; silicon; transceivers; 155 Mbit/s; STM-1 level telecommunications specifications; Si; V-groove; bidirectional optical coupling module; cleaved surface; coupling structure; flip-chip bonding; index-controlling medium; optical output power; packaging efforts; pin-photodiode; planar lightwave circuit based modules; refractive index; responsivity; Bidirectional control; Circuits; Diodes; Fiber lasers; Optical coupling; Optical refraction; Optical variables control; Optical waveguides; Packaging; Waveguide lasers;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.883758