• DocumentCode
    1406517
  • Title

    Process along thickness direction

  • Author

    Sato, Masahiro ; Yokoi, Hidetoshi

  • Author_Institution
    MID Appl. Dev. Lab., Matsushita Electr. Works Ltd., Osaka, Japan
  • Volume
    23
  • Issue
    4
  • fYear
    2000
  • fDate
    11/1/2000 12:00:00 AM
  • Firstpage
    729
  • Lastpage
    736
  • Abstract
    This paper describes a visualization mold with a glass-inserted structure which enables observation of the dynamic melt behavior inside the cavity along the thickness direction. The melt front profile and the behavior of the melt front surface were observed using a high speed video system, and analyzed with an image processor. Several experiments revealed that the melt advanced slipping on the cavity surface or lead frame. It was also found that the surface of the melt front moved from the cavity surface to the lead frame generally due to the difference in the flow resistance between the cavity surface and lead frame. The surface velocity of the melt front was related to the position of the melt front, that is, the surface velocity of the preceding melt front was slower than that of the following one. It suggests that the melt flow is affected by the melt in the opposite cavity beyond the lead frame.
  • Keywords
    encapsulation; integrated circuit packaging; melting; moulding; cavity surface; dynamic melt behavior; flow resistance; glass-inserted structure; high speed video system; melt front profile; melt front surface; surface velocity; thickness direction; visualization mold; Electronic packaging thermal management; Electronics packaging; Filling; Integrated circuit packaging; Packaging machines; Polymers; Resins; Surface resistance; Visualization; Wire;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/6040.883765
  • Filename
    883765