DocumentCode
1406935
Title
Wafer-to-wafer bonding for microstructure formation
Author
Schmidt, Martin A.
Author_Institution
Microsystems Technol. Lab., MIT, Cambridge, MA, USA
Volume
86
Issue
8
fYear
1998
fDate
8/1/1998 12:00:00 AM
Firstpage
1575
Lastpage
1585
Abstract
Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described. These processes have an impact in packaging and structure design. Processes are categorized into direct bonds, anodic bonds, and bonds with intermediate layers. Representative devices using wafer-to-wafer bonding are presented. Processes and methods for characterization of a range of bonding methods are discussed. Opportunities for continued development are outlined
Keywords
micromachining; wafer bonding; anodic bonding; direct bonding; intermediate layer bonding; microstructure fabrication; packaging; wafer-to-wafer bonding; Etching; Fabrication; Integrated circuit technology; Micromachining; Microstructure; Packaging; Silicon; Substrates; Wafer bonding; Wafer scale integration;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/5.704262
Filename
704262
Link To Document