Title :
Using biomedical engineering and “hidden capital” to provide educational outreach to disadvantaged populations
Author :
Drazan, John F. ; Scott, John M. ; Hoke, Jahkeen I. ; Ledet, Eric H.
Author_Institution :
Rensselaer Polytech. Inst., Troy, NY, USA
Abstract :
A hands-on learning module called “Science of the Slam” is created that taps into the passions and interests of an under-represented group in the fields of Science, Technology, Engineering and Mathematics (STEM). This is achieved by examining the use of the scientific method to quantify the biomechanics of basketball players who are good at performing the slam dunk. Students already have an intrinsic understanding of the biomechanics of basketball however this “hidden capital” has never translated into the underlying STEM concepts. The effectiveness of the program is rooted in the exploitation of “hidden capital” within the field of athletics to inform and enhance athletic performance. This translation of STEM concepts to athletic performance provides a context and a motivation for students to study the STEM fields who are traditionally disengaged from the classic engineering outreach programs. “Science of the Slam” has the potential to serve as a framework for other researchers to engage under-represented groups in novel ways by tapping into shared interests between the researcher and disadvantaged populations.
Keywords :
biomechanics; biomedical education; sport; STEM concept translation; STEM concepts; STEM fields; Science of the Slam; Science, Technology, Engineering and Mathematics; athletic field; athletic performance; basketball players; biomechanics; biomedical engineering; classic engineering outreach programs; disadvantaged populations; educational outreach; hands-on learning module; hidden capital; researcher; scientific method; slam dunk; under-represented groups; Biomechanics; Biomedical engineering; Context; Education; Force; Sociology; Statistics;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
DOI :
10.1109/EMBC.2014.6944787