DocumentCode :
140774
Title :
Virtual firm in biomedical education: A very successful experience
Author :
Butterlin, Nadia ; Flores, Steeven ; Guyon, Florent ; Blagosklonov, Oleg
Author_Institution :
Inst. Super. d´Ing. de Franche-Comte, Univ. of Franche-Comte, Besancon, France
fYear :
2014
fDate :
26-30 Aug. 2014
Firstpage :
5168
Lastpage :
5171
Abstract :
In May 2006, the Institut Superieur d´Ingenieurs de Franche-Comté (ISIFC) launched its own virtual firm, which was named Biotika® by students. Virtual means that this company has no real legal status. It is a pedagogic model; however, the situation scenario for the ISIFC student engineers is real. They are currently working in real conditions on the development of new medical devices and on the modernization of medical products. The need for these innovative medical devices was identified by the students during their second-year (6 weeks) internship in hospitals. Biotika® is open between March and December every year. The students are “recruited” following an imitation job interview and each is then entrusted with a mission (engineer, project manager etc.) in one of the company´s four departments: Research & Design, Quality-regulatory affairs, Clinical investigations, and Public relationsmarketing. The personnel of Biotika® work on the development of innovative medical devices and/or the preparation of CE or FDA certification for 2 days per week. Since its launch, Biotika® has developed eight products and obtained many grants and prizes from French research and governmental organizations. It is also certified ISO 13485.
Keywords :
biomedical education; biomedical equipment; Biotika; FDA certification; ISO 13485; biomedical education; innovative medical devices; medical product modernization; virtual firm; Companies; Educational institutions; Hospitals; Medical diagnostic imaging; Needles; Technological innovation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2014.6944789
Filename :
6944789
Link To Document :
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