• DocumentCode
    1407791
  • Title

    Accelerated aging and long-term reliability study of ion-implanted GaAs MMIC IF amplifier

  • Author

    Esfandiari, R. ; O´Neill, T.J. ; Lin, T.S. ; Kono, R.K.

  • Author_Institution
    TRW, Redondo Beach, CA, USA
  • Volume
    37
  • Issue
    4
  • fYear
    1990
  • fDate
    4/1/1990 12:00:00 AM
  • Firstpage
    1174
  • Lastpage
    1177
  • Abstract
    The results of reliability testing of ion-implanted GaAs monolithic microwave integrated circuit (MMIC) IF amplifiers (IFA) fabricated on 3-in chromium-doped GaAs LEC substrates are presented. Three accelerated aging tests and one long-term life test performed on more than 200 IFAs and totaling 13000 h have been completed. The predicted failure rate is less than 150 FITs for an operating temperature of 125°C. The mean time to failure (MTTF) is 107 h with an activation energy of 1.9 eV. The principle failure modes are degradation of IFA bias current and RF gain. Preliminary failure analysis indicates that degradation results from an increase in FET channel resistance and reduced transconductance
  • Keywords
    III-V semiconductors; MMIC; circuit reliability; failure analysis; field effect integrated circuits; gallium arsenide; integrated circuit testing; ion implantation; life testing; microwave amplifiers; 125 degC; FET channel resistance; GaAs; GaAs:Cr substrates; LEC substrates; MMIC IF amplifier; MTTF; RF gain degradation; accelerated aging tests; bias current degradation; depletion mode MESFET technology; failure analysis; failure modes; failure rate; ion implanted semiconductor; long-term life test; long-term reliability; monolithic microwave integrated circuit; reliability testing; transconductance reduction; Accelerated aging; Circuit testing; Degradation; Gallium arsenide; Integrated circuit reliability; Integrated circuit testing; Life testing; MMICs; Microwave integrated circuits; Monolithic integrated circuits;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.52461
  • Filename
    52461