DocumentCode :
1407818
Title :
A 2-μm BiCMOS process utilizing selective epitaxy
Author :
O, K.K. ; Lee, Hae-Seung ; Reif, R. ; Frank, W.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA
Volume :
35
Issue :
12
fYear :
1988
fDate :
12/1/1988 12:00:00 AM
Firstpage :
2436
Abstract :
The authors describe a BiCMOS process that incorporates a high-performance n-p-n bipolar structure with a cutoff frequency (f T) of 5 GHz and an isolated nonoptimized vertical p-n-p bipolar structure to a 2-μm twin-well CMOS process with poly-to-n+ capacitors. These high-performance structures are incorporated with only two additional masking steps without affecting the performance of the NMOS and PMOS transistors of the original CMOS process. The device characteristics for the NMOS and PMOS transistors are similar to those of the MOS transistors of the original CMOS process. The device characteristics of the vertical n-p-n and p-n-p transistors, as well as the NMOS and PMOS transistors, are described
Keywords :
BIMOS integrated circuits; integrated circuit technology; vapour phase epitaxial growth; 2 micron; 5 GHz; BiCMOS process; NMOS transistor; PMOS transistors; cutoff frequency; device characteristics; high-performance n-p-n bipolar structure; isolated nonoptimized vertical p-n-p bipolar structure; masking steps; poly-to-n+ capacitors; selective epitaxy; twin-well CMOS process; BiCMOS integrated circuits; Breakdown voltage; CMOS process; CMOS technology; Dielectrics; Epitaxial growth; Epitaxial layers; MOS devices; MOSFETs; Transistors;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.8849
Filename :
8849
Link To Document :
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