• DocumentCode
    1407984
  • Title

    Hands-On Experience in HPC With Secondary School Students

  • Author

    Slezak, Diego Fernández ; Turjanski, Pablo G. ; Montaldo, Damián ; Mocskos, Esteban E.

  • Author_Institution
    Dept. de Comput., Univ. de Buenos Aires, Buenos Aires, Argentina
  • Volume
    53
  • Issue
    1
  • fYear
    2010
  • Firstpage
    128
  • Lastpage
    135
  • Abstract
    It is a global concern that the number of students in computing-related fields has been decreasing in the last few years. As a way to improve this situation, several institutions have been implementing programs to attract and keep students in science and technology majors. This work describes a high-performance computing (HPC) course intended for secondary school students, which requires only the most basic infrastructure. In this hands-on workshop, the students learn how to assemble, install, and test a cluster. In parallel, students are exposed to a complete new area of knowledge, obtaining a more accurate view of the discipline of computer science and increasing their confidence in their ability to follow computer science. This course also provides opportunities for students to meet scientists and lose any misconceptions and negative stereotypes about science in general and computer science in particular. The aim of this paper is to detail the key concepts conveyed to students, share the course organization, materials, and examples used, and describe the overall experience.
  • Keywords
    computer science education; computer science education; hands-on workshop; high-performance computing course; secondary school students; Assembly; Computer science; Computer science education; Educational institutions; Proposals; Scholarships; Testing; Cluster; computer science education; high-performance computing (HPC); outreach; secondary school education; vocational guidance;
  • fLanguage
    English
  • Journal_Title
    Education, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9359
  • Type

    jour

  • DOI
    10.1109/TE.2009.2025491
  • Filename
    5247019