DocumentCode :
140819
Title :
Three-dimensional, flexible graphene bioelectronics
Author :
SungGyu Chun ; JongHyun Choi ; Ashraf, A. ; Sungwoo Nam
Author_Institution :
Dept. of Mech. Sci. & Eng., Univ. of Illinois, Urbana-Champaign, Champaign, IL, USA
fYear :
2014
fDate :
26-30 Aug. 2014
Firstpage :
5268
Lastpage :
5271
Abstract :
We report 3-dimensional (3D) graphene-based biosensors fabricated via 3D transfer of monolithic graphene-graphite structures. This mechanically flexible all-carbon structure is a prospective candidate for intimate 3D interfacing with biological systems. Monolithic graphene-graphite structures were synthesized using low pressure chemical vapor deposition (LPCVD) process relying on the heterostructured metal catalyst layers. Nonplanar substrates and wet-transfer method were used with a thin Au film as a transfer layer to achieve the 3D graphene structure. Instead of the typical wet-etching method, vapor-phase etching was performed to minimize the delamination of the graphene while removing the transfer layer. We believe that the monolithic graphene-graphite synthesis combined with the conformal 3D transfer will pave the way for the 3D conformal sensing capability as well as the intracellular recording of living cells in the future.
Keywords :
biosensors; chemical vapour deposition; etching; flexible electronics; gold; graphene; graphite; 3D graphene structure; 3D graphene-based biosensors; 3D transfer; LPCVD process; all-carbon structure; biological systems; flexible graphene bioelectronics; heterostructured metal catalyst layers; intracellular recording; living cells; low pressure chemical vapor deposition process; monolithic graphene-graphite structures; nonplanar substrates; thin gold film; vapor-phase etching; wet-etching method; wet-transfer method; Field effect transistors; Graphene; Metals; Nanobioscience; Substrates; Three-dimensional displays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2014.6944814
Filename :
6944814
Link To Document :
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