• DocumentCode
    140866
  • Title

    Top-k preferences in high dimensions

  • Author

    Yu, Anbo ; Agarwal, Pankaj K. ; Jun Yang

  • Author_Institution
    Dept. of Comput. Sci., Duke Univ., Durham, NH, USA
  • fYear
    2014
  • fDate
    March 31 2014-April 4 2014
  • Firstpage
    748
  • Lastpage
    759
  • Abstract
    Given a set of objects O, each with d numeric attributes, a top-k preference scores these objects using a linear combination of their attribute values, where the weight on each attribute reflects the interest in this attribute. Given a query preference q, a top-k query finds the k objects in O with highest scores with respect to q. Given a query object o and a set of preferences Q, a reverse top-k query finds all preferences q ∈ Q for which o becomes one of the top k objects with respect to q. Previous solutions to these problems are effective only in low dimensions. In this paper, we develop a solution for much higher dimensions (up to high tens), if many preferences exhibit sparsity-i.e., each specifies non-zero weights for only a handful (say 5-7) of attributes (though the subsets of such attributes and their weights can vary greatly). Our idea is to select carefully a set of low-dimensional core subspaces to “cover” the sparse preferences in a workload. These subspaces allow us to index them more effectively than the full-dimensional space. Being multi-dimensional, each subspace covers many possible preferences; furthermore, multiple subspaces can jointly cover a preference, thereby expanding the coverage beyond each subspace´s dimensionality. Experimental evaluation validates our solution´s effectiveness and advantages over previous solutions.
  • Keywords
    query processing; attribute values; full-dimensional space; high dimensions; low-dimensional core subspaces; numeric attributes; query preference; reverse top-k query; sparse preferences; subspace dimensionality; top-k preference;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Data Engineering (ICDE), 2014 IEEE 30th International Conference on
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/ICDE.2014.6816697
  • Filename
    6816697