DocumentCode :
1408668
Title :
Fast and Accurate Prediction of the Steady-State Throughput of Multicore Processors Under Thermal Constraints
Author :
Rao, Ravishankar ; Vrudhula, Sarma
Author_Institution :
Electr. Eng. Dept., Arizona State Univ., Tempe, AZ, USA
Volume :
28
Issue :
10
fYear :
2009
Firstpage :
1559
Lastpage :
1572
Abstract :
This paper describes a fast and accurate technique to predict the steady-state throughput and the corresponding power consumption of a homogeneous multicore processor for a given benchmark workload while accounting for speed reduction due to thermal constraints. The expressions contain several parameters of interest to a system designer, like the static and dynamic-power consumptions (for hottest block and for full chip), the vertical thermal resistance of the hottest block, the leakage sensitivity to temperature, the chip threshold temperature, the ambient temperature, etc. Their computational complexity is independent of the number of cores. These are incorporated in a system-level multicore power/thermal simulator that uses the PTScalar power model and the Hotspot thermal model. The analytical throughput and power predictions were within 1.7% of that predicted by the system-level simulator. However, the analytical technique takes less than 0.2 s for a given set of design parameters, making it well suited for early design-space exploration. In contrast, the numerical technique takes anywhere from a minute (for 4 cores) up to a few hours (for 25 cores).
Keywords :
computational complexity; microprocessor chips; thermal resistance; ambient temperature; chip threshold temperature; computational complexity; dynamic-power consumptions; homogeneous multicore processor; leakage sensitivity; steady-state throughput; thermal constraints; vertical thermal resistance; Dynamic thermal management (DTM); frequency scaling; multicore processors; power management; throughput optimization;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2009.2026361
Filename :
5247119
Link To Document :
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