• DocumentCode
    1408668
  • Title

    Fast and Accurate Prediction of the Steady-State Throughput of Multicore Processors Under Thermal Constraints

  • Author

    Rao, Ravishankar ; Vrudhula, Sarma

  • Author_Institution
    Electr. Eng. Dept., Arizona State Univ., Tempe, AZ, USA
  • Volume
    28
  • Issue
    10
  • fYear
    2009
  • Firstpage
    1559
  • Lastpage
    1572
  • Abstract
    This paper describes a fast and accurate technique to predict the steady-state throughput and the corresponding power consumption of a homogeneous multicore processor for a given benchmark workload while accounting for speed reduction due to thermal constraints. The expressions contain several parameters of interest to a system designer, like the static and dynamic-power consumptions (for hottest block and for full chip), the vertical thermal resistance of the hottest block, the leakage sensitivity to temperature, the chip threshold temperature, the ambient temperature, etc. Their computational complexity is independent of the number of cores. These are incorporated in a system-level multicore power/thermal simulator that uses the PTScalar power model and the Hotspot thermal model. The analytical throughput and power predictions were within 1.7% of that predicted by the system-level simulator. However, the analytical technique takes less than 0.2 s for a given set of design parameters, making it well suited for early design-space exploration. In contrast, the numerical technique takes anywhere from a minute (for 4 cores) up to a few hours (for 25 cores).
  • Keywords
    computational complexity; microprocessor chips; thermal resistance; ambient temperature; chip threshold temperature; computational complexity; dynamic-power consumptions; homogeneous multicore processor; leakage sensitivity; steady-state throughput; thermal constraints; vertical thermal resistance; Dynamic thermal management (DTM); frequency scaling; multicore processors; power management; throughput optimization;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2009.2026361
  • Filename
    5247119