DocumentCode :
1408860
Title :
A technique for fast calculation of capacitance matrices of interconnect structures
Author :
Veremey, Vladimir ; Mittra, Raj
Author_Institution :
Electromagnetic Commun. Res. Lab., Pennsylvania State Univ., University Park, PA, USA
Volume :
21
Issue :
3
fYear :
1998
fDate :
8/1/1998 12:00:00 AM
Firstpage :
241
Lastpage :
249
Abstract :
A finite difference (FD) method for rapid and accurate evaluation of capacitance matrices of interconnect configurations is described in this paper. The method utilizes newly-developed perfectly matching layer (PML) technique for mesh truncation, specially adapted to the static case in conjunction with a mixed boundary condition, referred to as the α-technique. The application of proposed approach to the modeling of complex structures, comprising multiple metal layers, cross-overs, vias, and bends embedded in a layered dielectric medium, is illustrated in the paper. The paper also shows the usefulness of the technique to the problem of mapping within the interconnect. A novel approach for efficient truncation of a class of large interconnects called the wraparound scheme, is introduced in the paper. Several numerical examples that illustrate the efficiency and flexibility of the approaches, described above, are included in the paper
Keywords :
capacitance; finite difference methods; integrated circuit interconnections; integrated circuit packaging; mesh generation; α-technique; bends; capacitance matrices; cross-overs; finite difference method; interconnect structures; layered dielectric medium; mesh truncation; mixed boundary condition; multiple metal layers; perfectly matching layer; vias; wraparound scheme; Boundary conditions; Boundary element methods; Capacitance; Delay estimation; Dielectrics; Electronics packaging; Finite difference methods; Parameter extraction; Perfectly matched layers; Time domain analysis;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.704934
Filename :
704934
Link To Document :
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