• DocumentCode
    1408860
  • Title

    A technique for fast calculation of capacitance matrices of interconnect structures

  • Author

    Veremey, Vladimir ; Mittra, Raj

  • Author_Institution
    Electromagnetic Commun. Res. Lab., Pennsylvania State Univ., University Park, PA, USA
  • Volume
    21
  • Issue
    3
  • fYear
    1998
  • fDate
    8/1/1998 12:00:00 AM
  • Firstpage
    241
  • Lastpage
    249
  • Abstract
    A finite difference (FD) method for rapid and accurate evaluation of capacitance matrices of interconnect configurations is described in this paper. The method utilizes newly-developed perfectly matching layer (PML) technique for mesh truncation, specially adapted to the static case in conjunction with a mixed boundary condition, referred to as the α-technique. The application of proposed approach to the modeling of complex structures, comprising multiple metal layers, cross-overs, vias, and bends embedded in a layered dielectric medium, is illustrated in the paper. The paper also shows the usefulness of the technique to the problem of mapping within the interconnect. A novel approach for efficient truncation of a class of large interconnects called the wraparound scheme, is introduced in the paper. Several numerical examples that illustrate the efficiency and flexibility of the approaches, described above, are included in the paper
  • Keywords
    capacitance; finite difference methods; integrated circuit interconnections; integrated circuit packaging; mesh generation; α-technique; bends; capacitance matrices; cross-overs; finite difference method; interconnect structures; layered dielectric medium; mesh truncation; mixed boundary condition; multiple metal layers; perfectly matching layer; vias; wraparound scheme; Boundary conditions; Boundary element methods; Capacitance; Delay estimation; Dielectrics; Electronics packaging; Finite difference methods; Parameter extraction; Perfectly matched layers; Time domain analysis;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.704934
  • Filename
    704934