DocumentCode
1408860
Title
A technique for fast calculation of capacitance matrices of interconnect structures
Author
Veremey, Vladimir ; Mittra, Raj
Author_Institution
Electromagnetic Commun. Res. Lab., Pennsylvania State Univ., University Park, PA, USA
Volume
21
Issue
3
fYear
1998
fDate
8/1/1998 12:00:00 AM
Firstpage
241
Lastpage
249
Abstract
A finite difference (FD) method for rapid and accurate evaluation of capacitance matrices of interconnect configurations is described in this paper. The method utilizes newly-developed perfectly matching layer (PML) technique for mesh truncation, specially adapted to the static case in conjunction with a mixed boundary condition, referred to as the α-technique. The application of proposed approach to the modeling of complex structures, comprising multiple metal layers, cross-overs, vias, and bends embedded in a layered dielectric medium, is illustrated in the paper. The paper also shows the usefulness of the technique to the problem of mapping within the interconnect. A novel approach for efficient truncation of a class of large interconnects called the wraparound scheme, is introduced in the paper. Several numerical examples that illustrate the efficiency and flexibility of the approaches, described above, are included in the paper
Keywords
capacitance; finite difference methods; integrated circuit interconnections; integrated circuit packaging; mesh generation; α-technique; bends; capacitance matrices; cross-overs; finite difference method; interconnect structures; layered dielectric medium; mesh truncation; mixed boundary condition; multiple metal layers; perfectly matching layer; vias; wraparound scheme; Boundary conditions; Boundary element methods; Capacitance; Delay estimation; Dielectrics; Electronics packaging; Finite difference methods; Parameter extraction; Perfectly matched layers; Time domain analysis;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.704934
Filename
704934
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