DocumentCode
1408900
Title
Figures-of-merit for package electrical roadmaps
Author
Young, Brian
Author_Institution
Somerset Design Center, Motorola Inc., Austin, TX, USA
Volume
21
Issue
3
fYear
1998
fDate
8/1/1998 12:00:00 AM
Firstpage
281
Lastpage
285
Abstract
Transient currents created by on-chip switching in cores and by off-chip drivers cause noise to be generated on package parasitics. Simple mathematical models for the noise are used to derive figures-of-merit for the two cases of on-chip and off-chip switching. SIA Roadmap packaging trends are used with the figures-of-merit to produce package noise trends
Keywords
integrated circuit modelling; integrated circuit noise; integrated circuit packaging; transients; SIA Roadmap packaging trends; mathematical noise models; off-chip driver; on-chip switching; package electrical roadmaps; package noise trends; package parasitics; transient currents; Circuit noise; Circuit simulation; Clocks; Electronics packaging; Equivalent circuits; Laplace equations; Microprocessors; Noise figure; Physics; Power system modeling;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.704939
Filename
704939
Link To Document