DocumentCode :
1408914
Title :
Design methodology for chip-on-chip applications
Author :
Low, Yee L. ; Frye, Robert C. ; O´Connor, Kevin J.
Author_Institution :
Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA
Volume :
21
Issue :
3
fYear :
1998
fDate :
8/1/1998 12:00:00 AM
Firstpage :
298
Lastpage :
301
Abstract :
Chip-on-chip is a viable alternative solution for some applications requiring logic and memory integration. However, one of the impediments to this technology is lack of design infrastructure. Conventional multichip design methodologies which are extensions of standard board designs are not well-suited to chip-on-chip designs. To address this issue, we have implemented a chip-on-chip design methodology that incorporates both logic and memory design database and utilizes an auto-router to minimize routing layers. It emulates a two-layer routing system by using a single redistribution metal layer on each chip and solder bumps as vias. In this paper, we describe several chip-on-chip modules designed using this methodology and discuss the method´s limitations
Keywords :
integrated circuit design; integrated circuit packaging; network routing; IC packaging; auto-router; chip-on-chip applications; design infrastructure; logic design; memory design; routing layers; single redistribution metal layer; solder bumps; two-layer routing system; Costs; Design methodology; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Logic circuits; Logic devices; Microprocessors; Routing; Testing;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.704941
Filename :
704941
Link To Document :
بازگشت