DocumentCode :
1408939
Title :
Simulation of “Ab Initio” Quantum Confinement Scattering in UTB MOSFETs Using Three-Dimensional Ensemble Monte Carlo
Author :
Riddet, Craig ; Alexander, Craig ; Brown, Andrew R. ; Roy, Scott ; Asenov, Asen
Author_Institution :
Dept. of Electron. & Electr. Eng., Univ. of Glasgow, Glasgow, UK
Volume :
58
Issue :
3
fYear :
2011
fDate :
3/1/2011 12:00:00 AM
Firstpage :
600
Lastpage :
608
Abstract :
In this paper, we report a 3-D Monte Carlo (MC) simulation methodology that includes complex quantum confinement effects captured through the introduction of robust and efficient density gradient (DG) quantum corrections (QCs), which has been used to introduce “ab initio ” scattering from quantum confinement fluctuations in ultrathin body silicon-on-insulator metal-oxide-semiconductor field-effect transistors (MOSFETs) through the real space trajectories of the particles driven by the DG effective quantum potential and to study the enhanced current variability due to the corresponding transport variations. A “frozen field” approximation, where neither the field nor the QCs are updated, has been used to examine the dependence of mobility on silicon thickness in large self-averaging devices. This approximation, along with the MC simulations that are self-consistent with Poisson´s equation, is applied to study the variability of on-current due to random body thickness fluctuations in thin-body MOSFETs at low and high drain biases.
Keywords :
MOSFET; Monte Carlo methods; Poisson equation; silicon-on-insulator; 3D Monte Carlo simulation; Poisson equation; UTB MOSFET; ab initio quantum confinement scattering; complex quantum confinement; density gradient quantum corrections; metal-oxide-semiconductor field-effect transistors; quantum confinement fluctuations; ultrathin body silicon-on-insulator; Drift diffusion (DD); MOSFET; Monte Carlo (MC); double gate; quantum corrections; scattering; silicon-on-insulator (SOI); variability;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2010.2095422
Filename :
5672594
Link To Document :
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