DocumentCode
1409065
Title
Analytical Predictions of the Thermal Signatures of Honeycomb Panel Bond Defects
Author
Ashley, Robert M.
Author_Institution
Martin Marietta Corporation, Denver, Colo. 80201.
Issue
4
fYear
1973
Firstpage
212
Lastpage
217
Abstract
This paper presents the results of digital computer studies of honeycomb panel surface temperature response to radiant heating as a function of the subsurface adhesive bond geometry and degree of interfacial wetting. An experiment is proposed to validate correllating incomplete interfacial wetting with bond strength deficiencies.
Keywords
Aircraft manufacture; Bonding; Building materials; Conducting materials; Heat transfer; Heating; Inspection; Radiometry; Response surface methodology; Temperature;
fLanguage
English
Journal_Title
Industrial Electronics and Control Instrumentation, IEEE Transactions on
Publisher
ieee
ISSN
0018-9421
Type
jour
DOI
10.1109/TIECI.1973.5408635
Filename
5408635
Link To Document