Title :
Analytical Predictions of the Thermal Signatures of Honeycomb Panel Bond Defects
Author :
Ashley, Robert M.
Author_Institution :
Martin Marietta Corporation, Denver, Colo. 80201.
Abstract :
This paper presents the results of digital computer studies of honeycomb panel surface temperature response to radiant heating as a function of the subsurface adhesive bond geometry and degree of interfacial wetting. An experiment is proposed to validate correllating incomplete interfacial wetting with bond strength deficiencies.
Keywords :
Aircraft manufacture; Bonding; Building materials; Conducting materials; Heat transfer; Heating; Inspection; Radiometry; Response surface methodology; Temperature;
Journal_Title :
Industrial Electronics and Control Instrumentation, IEEE Transactions on
DOI :
10.1109/TIECI.1973.5408635
