• DocumentCode
    1409434
  • Title

    Modeling, qualitative analysis, and performance evaluation of the etching area in an IC wafer fabrication system using Petri nets

  • Author

    Jeng, Mu Der ; Xie, Xiaolan ; Chou, Shih Wei

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Ocean Univ., Keelung, Taiwan
  • Volume
    11
  • Issue
    3
  • fYear
    1998
  • fDate
    8/1/1998 12:00:00 AM
  • Firstpage
    358
  • Lastpage
    373
  • Abstract
    Integrated circuit (IC) wafer fabrication systems can be characterized as discrete event systems. Petri nets are tools that have been successfully used to model and analyze such systems. This paper reports a project of applying Petri net methodologies to detailed modeling, qualitative analysis, and performance evaluation of the etching area in a real-world IC wafer fabrication system located in Taiwan´s Hsinchu Science-Based Industrial Park, To tackle the problem of building a large and complex system model, a synthesis technique is used. The resultant extended net model is checked for important qualitative properties in manufacturing. A simple control policy for deadlock prevention is proposed. To obtain performance measures, simulation is used. The simulation result shows that except a small number of machines, the errors between the simulated and actual utilizations are less than 5%, The validated model can be used to answer many “what-if” questions, such as predicting the maximal throughput and bottleneck machines
  • Keywords
    Petri nets; discrete event systems; etching; semiconductor process modelling; IC wafer fabrication; Petri net; discrete event system; etching area; modeling; performance evaluation; qualitative analysis; simulation; synthesis; Discrete event systems; Electrical equipment industry; Etching; Fabrication; Integrated circuit modeling; Integrated circuit synthesis; Performance analysis; Petri nets; Predictive models; Semiconductor device modeling;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.705371
  • Filename
    705371