DocumentCode :
1409559
Title :
Microstructure of the {\\rm MgB}_{2} Wires Resulting by the Infiltration Process
Author :
Saglietti, Luca ; Orecchia, Claudio ; Albisetti, Alessandro Figini ; Perini, Elena ; Giunchi, Giovanni
Author_Institution :
R&D Div., EDISON SpA, Milan, Italy
Volume :
21
Issue :
3
fYear :
2011
fDate :
6/1/2011 12:00:00 AM
Firstpage :
2655
Lastpage :
2658
Abstract :
MgB2 manufacts sintering requires a special attention in order to promote a good grain connectivity. In case of wires production, where application of pressure during sintering is practically unrealistic, the “in-situ” methods give a higher connectivity with respect to the “ex-situ” methods. In order to further improve the in-situ processing technology for the wires, we perform the Mg-RLI process, in which liquid Mg infiltration proceeds from the inner core of the wires to the surrounding B powders. The detailed microstructure analysis on the resulting MgB2 layer of these wires shows the influence of different B powders and different operative conditions of the process, giving explanations about the relationship between powder packing density and impurity phase abundance. In particular we discuss the use, as starting precursor materials, of low-price boron powders.
Keywords :
crystal microstructure; impurities; magnesium compounds; melt infiltration; powder technology; sintering; superconducting materials; Mg-RLI process; MgB2; MgB2 layer; MgB2 wires; grain connectivity; impurity phase abundance; infiltration process; liquid Mg infiltration; low-price boron powders; microstructure analysis; operative conditions; powder packing density; processing technology; sintering; wire production; Boron; Impurities; Microstructure; Powders; Superconducting filaments and wires; Superconducting magnets; Wires; ${rm MgB}_{2}$ wires; Impurity phases; infiltration process; microstructure; packing density;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2010.2092400
Filename :
5672809
Link To Document :
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