DocumentCode
1409846
Title
Foreword Polymeric Electronics Packaging
Author
Morris, James E. ; Liu, Jiangchuan
Author_Institution
State University of New York at Binghamton
Volume
21
Issue
2
fYear
1998
fDate
6/1/1998 12:00:00 AM
Firstpage
206
Lastpage
207
Keywords
Components, Packaging, and Manufacturing Technology Society; Components, packaging, and manufacturing technology; Conducting materials; Conductive adhesives; Electronics packaging; Finite element methods; In vitro fertilization; Independent component analysis; Materials science and technology; Polymers;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/TCPMA.1998.705465
Filename
705465
Link To Document