Quantitative estimate of the characteristics of conductive particles in ACA by using nano-indenter

Author

Wang, Xitao ; Wang, Yanli ; Chen, Guoliang ; Liu, Johan ; Lai, Zonghe

Author_Institution

State Key Lab. for Adv. Metals & Mater., Univ. of Sci. & Technol. of China, Beijing, China

Volume

21

Issue

2

fYear

1998

fDate

6/1/1998 12:00:00 AM

Firstpage

248

Lastpage

251

Abstract

The characteristics of conductive particles in anisotropically conductive adhesives (ACA) were studied using optical microscope and nano-indenter. The indentation measurements were performed at the particles in ACA joints using different bonding forces. Load-displacement curves and microhardness values are obtained, which indicate that the nano-indenter could be used for quantitative estimates of the electrical and mechanical characteristics of conductive particles in ACAs

Keywords

adhesion; conducting materials; flip-chip devices; mechanical testing; microhardness; optical microscopy; ACA; anisotropically conductive adhesives; bonding forces; conductive particles; flip-chip bonding; indentation measurements; load-displacement curves; microhardness value; nano-indenter; optical microscope; Anisotropic magnetoresistance; Bonding; Chemical technology; Conductive adhesives; Glass; Mechanical factors; Mechanical variables measurement; Optical microscopy; Particle measurements; Performance evaluation;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.705471

Filename

705471