Conductive adhesive materials for lead solder replacement

Author

Suzuki, Kenichi ; Suzuki, Osamu ; Komagata, Mitinori

Author_Institution

Namics Corp., Niigata, Japan

Volume

21

Issue

2

fYear

1998

fDate

6/1/1998 12:00:00 AM

Firstpage

252

Lastpage

258

Abstract

Various adhesives were tested for MLCC and integrated circuit (IC) applications as lead solder replacements, mainly from the viewpoint of contact resistance and adhesion strength. Current-voltage and frequency characteristics were also measured. On the whole, the contact resistance depended on the volume resistivity of each adhesive. Different termination and bump materials gave different contact resistance values. Especially, Sn plated terminations tended to give higher contact resistance. The adhesion strengths were also influenced by the kinds of adhesives, electrode, termination and bump materials. Although the Ni filled adhesive, which had good adhesion strength and didn´t cause electro-migration, had higher volume resistivity, it gave good I-V characteristics at low current

Keywords

adhesion; conducting materials; contact resistance; integrated circuit packaging; integrated circuit reliability; I-V characteristics; MLCC; adhesion strength; bump materials; conductive adhesive materials; contact resistance; current-voltage characteristics; frequency characteristics; volume resistivity; Application specific integrated circuits; Circuit testing; Conducting materials; Conductive adhesives; Conductivity; Contact resistance; Current measurement; Frequency; Integrated circuit testing; Lead;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.705472

Filename

705472