• DocumentCode
    1409979
  • Title

    Reliability assessment of electronic components exposed to long-term non-operating conditions

  • Author

    McCluskey, F. Patrick ; Hakim, Edward B. ; Fink, John ; Fowler, Andre ; Pecht, Michael G.

  • Author_Institution
    CALCE, Maryland Univ., College Park, MD, USA
  • Volume
    21
  • Issue
    2
  • fYear
    1998
  • fDate
    6/1/1998 12:00:00 AM
  • Firstpage
    352
  • Lastpage
    359
  • Abstract
    The decreased availability of MIL-SPEC components is forcing designers of low volume complex electronic systems, such as avionics and defense electronics, to consider the use of commercial off-the-shelf plastic encapsulated microcircuits (COTS PEMs). Traditionally, designers of these long-life, high reliability systems have been reluctant to use COTS PEMs because of concerns related to their capability to survive in harsh environments over long periods of continuous or intermittent operation. Many commercial insertion studies in the last several years have now conclusively demonstrated that PEMs made using best commercial materials, processes, and quality techniques will permit devices to perform reliably in the most severe environments. However, only recently have studies focused on the reliability of PEMs in that subset of applications requiring short time operation after long periods of unpowered storage (10 to 20 yrs). This paper presents the results of five critical commercial insertion studies focusing on long term storage reliability. These studies include analysis of PEMs, hermetic microcircuits, and assemblies stored for up to 28 yrs in various storage locations around the world. Regardless of the storage conditions, commercial grade PEMs, without screening or incoming inspection, survived assembly and extended storage, even though, in some cases, degradation was observed on the boards
  • Keywords
    encapsulation; integrated circuit packaging; integrated circuit reliability; plastic packaging; COTS PEM; avionics; commercial insertion; commercial off-the-shelf plastic encapsulated microcircuit; defense electronics; electronic component; harsh environment; hermetic microcircuit; long term dormant storage; low volume complex system; reliability; Aerospace electronics; Assembly; Automotive electronics; Availability; Costs; Electronic components; Electronics packaging; Marketing and sales; Plastics; Semiconductor device packaging;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.705484
  • Filename
    705484