مرکز منطقه ای اطلاع رساني علوم و فناوري - Special issue on materials, processing and reliability of 3D interconnects

DocumentCode :

1410053

Title :

Special issue on materials, processing and reliability of 3D interconnects

Volume :

Issue :

fYear :

2011

Firstpage :

276

Lastpage :

276

Abstract :

Provides notice of upcoming special issue(s) of interest to practitioners and researchers.

fLanguage :

English

Journal_Title :

Electron Devices, IEEE Transactions on

Publisher :

ieee

ISSN :

0018-9383

Type :

jour

DOI :

10.1109/TED.2010.2090429

Filename :

5673447

Link To Document :