Title :
Analyzing packaging trade-offs during system design
Author :
Sandborn, Peter A. ; Vertal, Mike
Author_Institution :
Dept. of Mech. Eng., Maryland Univ., College Park, MD, USA
Abstract :
Integrating packaging trade-off analysis with functional verification and architectural design results in a complete virtual prototyping solution far optimizing complex electronic systems. The authors discuss the role of packaging costs in system design and present examples highlighting packaging design trade-offs
Keywords :
packaging; architectural design; functional verification; packaging design; packaging trade-off; virtual prototyping; Computer architecture; Cost function; Design optimization; Electronic equipment testing; Electronics packaging; Feedback; Hardware; System analysis and design; System testing; Virtual prototyping;
Journal_Title :
Design & Test of Computers, IEEE
