Title :
The role of the good-die project in miniaturized-system design
Author_Institution :
IMEC, Leuven, Belgium
Abstract :
Existing CAD tools need major changes to cope with the design requirements of high-density packaging technologies. A database service is now available on the Internet to address one area of great need-bare-die component selection and automated generation of component symbols
Keywords :
Internet; circuit CAD; information services; packaging; CAD tools; GoodDie Internet Service; Internet; MCM design automation; bare-die component selection; component symbols; database service; high-density packaging; Application specific integrated circuits; Design automation; Driver circuits; Engines; Manufacturing; Packaging; Power system interconnection; Production systems; Switches; System testing;
Journal_Title :
Design & Test of Computers, IEEE
