DocumentCode
1411182
Title
Testing NASA´s 3D-stack MCM space flight computer
Author
Sasidhar, Koppol ; Alkalai, Leon ; Chatterjee, Abhijit
Author_Institution
Georgia Inst. of Technol., Atlanta, GA, USA
Volume
15
Issue
3
fYear
1998
Firstpage
44
Lastpage
55
Abstract
Advanced packaging technologies pose major testing challenges for complex designs. The authors present test strategies used in the space flight computer designed for NASA´s Deep Space-1 mission
Keywords
aircraft computers; circuit testing; computer testing; multichip modules; packaging; 3D-stack MCM; Deep Space-1; packaging; space flight computer; test strategies; Built-in self-test; Circuit testing; Clocks; Integrated circuit interconnections; Logic testing; NASA; Packaging; Registers; Space technology; System testing;
fLanguage
English
Journal_Title
Design & Test of Computers, IEEE
Publisher
ieee
ISSN
0740-7475
Type
jour
DOI
10.1109/54.706032
Filename
706032
Link To Document