DocumentCode
1411255
Title
A D&T roundtable: challenges for low-power and high-performance chips
Author
Ching-Te Chuang ; De, Vivek ; Shih-Lien Lu ; Soumyanath, K. ; Partovi, H. ; Sakurai, Takayasu
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Volume
15
Issue
3
fYear
1998
Firstpage
119
Lastpage
124
Abstract
Microprocessor and other lC performance continues to improve at historic rates, with no visible end in sight for the next 10 years. However, we are starting to encounter a power wall. This is true for high-performance components as well as for low-power chips with a very limited energy budget offered by batteries. We need to find ways to manage power and energy consumption on all fronts-technology, design, and architecture-without compromising performance. Otherwise, we may face discontinuation of Moore´s law for the semiconductor industry in the near future. This would be triggered not by any difficulty in the scaling of process technology but by formidable barriers posed by packaging and cooling, inefficacy of power delivery, and energy constraints dictated by battery technology, which is advancing at a very lukewarm pace.
Keywords
microprocessor chips; technological forecasting; high-performance; high-performance components; low-power; low-power chips; microprocessor; Batteries; Circuit testing; Cooling; Electronics industry; Energy consumption; Energy management; Microprocessors; Moore´s Law; Semiconductor device packaging; Voltage;
fLanguage
English
Journal_Title
Design & Test of Computers, IEEE
Publisher
ieee
ISSN
0740-7475
Type
jour
DOI
10.1109/54.706043
Filename
706043
Link To Document