• DocumentCode
    1411255
  • Title

    A D&T roundtable: challenges for low-power and high-performance chips

  • Author

    Ching-Te Chuang ; De, Vivek ; Shih-Lien Lu ; Soumyanath, K. ; Partovi, H. ; Sakurai, Takayasu

  • Author_Institution
    IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
  • Volume
    15
  • Issue
    3
  • fYear
    1998
  • Firstpage
    119
  • Lastpage
    124
  • Abstract
    Microprocessor and other lC performance continues to improve at historic rates, with no visible end in sight for the next 10 years. However, we are starting to encounter a power wall. This is true for high-performance components as well as for low-power chips with a very limited energy budget offered by batteries. We need to find ways to manage power and energy consumption on all fronts-technology, design, and architecture-without compromising performance. Otherwise, we may face discontinuation of Moore´s law for the semiconductor industry in the near future. This would be triggered not by any difficulty in the scaling of process technology but by formidable barriers posed by packaging and cooling, inefficacy of power delivery, and energy constraints dictated by battery technology, which is advancing at a very lukewarm pace.
  • Keywords
    microprocessor chips; technological forecasting; high-performance; high-performance components; low-power; low-power chips; microprocessor; Batteries; Circuit testing; Cooling; Electronics industry; Energy consumption; Energy management; Microprocessors; Moore´s Law; Semiconductor device packaging; Voltage;
  • fLanguage
    English
  • Journal_Title
    Design & Test of Computers, IEEE
  • Publisher
    ieee
  • ISSN
    0740-7475
  • Type

    jour

  • DOI
    10.1109/54.706043
  • Filename
    706043