• DocumentCode
    1411510
  • Title

    An Efficient SPICE-Compatible Model for Striplines Including Cavity Resonant Effect

  • Author

    Jian-Min Lu ; Yu-Shan Li ; Mu-Shui Zhang

  • Author_Institution
    Inst. of Electron. CAD, Xidian Univ., Xi´an, China
  • Volume
    54
  • Issue
    4
  • fYear
    2012
  • Firstpage
    815
  • Lastpage
    825
  • Abstract
    In this paper, an efficient SPICE-compatible cavity resonant model for nonideal striplines including power noise coupling is proposed based on mode decomposition theory. According to the mode decomposition theory, the model for nonideal striplines includes two parts-transmission lines and power plane pairs-which are modeled by cavity resonant model purely. Two efficient methods, the double-frequency approximation for power plane pairs, and the Padé approximation for transmission lines, are proposed for model simplification, which are verified by rigorous error analysis and comparison with the typical modeling method available. Finally, an efficient SPICE-compatible cavity resonant model for nonideal striplines including power noise coupling is given and verified in the time and frequency domains by comparison with the typical modeling method available.
  • Keywords
    SPICE; approximation theory; cavity resonators; error analysis; frequency-domain analysis; strip lines; time-domain analysis; transmission line theory; Padé approximation; SPICE-compatible cavity resonant model; cavity resonant effect; double-frequency approximation; error analysis; frequency-domain analysis; mode decomposition theory; nonideal strip lines; parts-transmission lines; power noise coupling; power plane pairs; time-domain analysis; Approximation methods; Cavity resonators; Impedance; Inductance; Integrated circuit modeling; Solid modeling; Stripline; Cavity resonant model; Padé approximation; double-frequency approximation; power plane pair; stripline;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2011.2178418
  • Filename
    6118323